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9783319343013 - Mohd N. Tamin, Norhashimah M. Shaffiar: Solder Joint Reliability Assessment: Finite Element Simulation Methodology
1
Mohd N. Tamin, Norhashimah M. Shaffiar (?):

Solder Joint Reliability Assessment: Finite Element Simulation Methodology (?)

Delivery from: Netherlands

ISBN: 9783319343013 (?) or 3319343017, in german, Springer, Paperback, New

ETB 6 ( 189.00)¹(without obligation)
Nog niet verschenen - reserveer een exemplaar
bol.com
Taal: Engels;ISBN10: 3319343017;ISBN13: 9783319343013; Engelstalig | paperback
seller comment bol.com:
Nieuw, Nog niet verschenen - reserveer een exemplaar
Platform order number Bol.com: 9200000064209610
Category: Techniek & Technologie, Techniek & Mechanica /, Techniek & Technologie, Werktuigbouwkunde
Data from 09/02/2016 13:01h
ISBN (alternative notations): 3-319-34301-7, 978-3-319-34301-3
9783319343013 - Mohd N. Tamin#Norhashimah M. Shaffiar: Solder Joint Reliability Assessment
2
Mohd N. Tamin#Norhashimah M. Shaffiar (?):

Solder Joint Reliability Assessment (?)

ISBN: 9783319343013 (?) or 3319343017, in english, New

ETB 4 ( 139.10)¹(free shipping, without obligation)
Versandfertig innerhalb von 3 Wochen
From Seller/Antiquarian
This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more. This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.
Seller order number: 46278062
Platform order number Buch.de: 2e1f29910e3df2d7f74926a3f86509 af
Category: Bücher / Fremdsprachige Bücher / Englische Bücher
Keywords: Bücher
Data from 09/02/2016 13:01h
ISBN (alternative notations): 3-319-34301-7, 978-3-319-34301-3
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